Day 3 takes technology to exciting new heights with key disclosures on Software and 3D Web. Tune in as Allyson recaps the best, brightest and most promising news from the IDF-SF.

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Get connected with the pulse of Day 2 at the Intel Developer Forum, as Allyson visits the Technology Showcase and recaps key disclosures on Mobility, Penryn and Power Management.

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Tune in to get the latest on exciting new technology disclosures and happenings from the Intel Developer Forum (IDF) including Paul Otellini’s keynote and Gordon Moore’s interview.

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Halogenated materials are an electronics industry norm – hear how Intel is creating a new norm by innovating halogen-free products for a healthy planet.

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In another world’s first, Intel has produced a fully functional 32nm SRAM logic chip packing more than 1.9 billion second generation high-k metal gate transistors.

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Intel’s next-generation 45nm Hi-k microarchitecture (code named “Nehalem”) is a dynamically scalable microarchitecture that delivers breakthrough energy-efficient performance.

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Introducing Intel’s next-gen distributed shared memory architecture featuring high speed interconnects.

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US data centers consumed 61 billion kW hours of electricity in 2006 - learn how Intel and the industry are applying technology and research to mitigate energy consumption.

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Gordon E. Moore, Intel retired chairman and CEO (and chairman emeritus of the board) spoke with Moira Gunn onstage at the Intel Developer Forum in San Francisco, in an interview that Intel called a “fireside chat.”

In this segment, find out whether or not you owe your workplace set-up to Moore ...

Gordon E. Moore, Intel retired chairman and CEO (and chairman emeritus of the board) spoke with Moira Gunn onstage at the Intel Developer Forum in San Francisco, in an interview that Intel called a “fireside chat.”

In this segment, find out how Intel really got its start, and how much of ...

How does Intel contend with rapid innovation cadence, long development cycles and mid-stream energy regulations? Tune in to find out!

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Tera-bytes of digital information in your home or office? Learn how Intel is designing solutions for entry level storage.

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45nm Program Manager Kaizad Mistry takes you inside the groundbreaking 45nm Hi-k metal gate process technology used in the next generation of Intel Core microarchitecture.

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Andrew Fanara, Team Leader for the Energy Star Products Group with the EPA, discusses how Energy Star impacts computing platforms from both a client and a data center perspective.

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What’s important about 45nm and Intel’s 100% Lead-Free initiative? Hear about this and what’s in Intel’s DNA in this insightful interview with Todd Brady, Corporate Environmental Manager.

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David Fair explains how PCI Express* Gen 2 increases speed, device interoperability and bandwidth. He also provides insight into the Geneseo proposal that Intel and IBM gave to PCI-SIG.

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Lorie Wigle discusses Intel’s work through the newly-launched initiative to establish innovative energy efficiency and power management targets for the computing industry.

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Stephen Fischer, lead architect for Penryn, talks of major innovations in the next-gen 45nm process technology, and explains this tick in the Tick Tock model in his interview with Allyson Klein.

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Nash Palaniswamy talks about Intel’s accelerator strategy and the scope, benefits and features of Intel QuickAssist Technology, in an informal interview with Allyson Klein.