Driving technology innovation on a reliable and predictable timeline, Intel developed a model designed to deliver ongoing innovation. Referred to as our tick-tock model, Intel has successfully alternated and delivered the next generation of silicon technology as well as new processor microarchitecture year after year.
Intel CIO Diane Bryant shares how, during the “Tick,” Intel delivers new silicon process technology, dramatically increasing transistor density while enhancing performance and energy efficiency within a smaller, more refined version of our existing microarchitecture.
In the second year, the “Tock” delivers entirely new processor microarchitecture to optimize the value of the increased number of transistors and technology updates now available.
If you’re an investor, you can stay on top of all the ways Intel pushes the boundaries of innovation, making news in technology, manufacturing, education, culture and social responsibiliy. Learn more about the rhythm of Intel’s advancing silicon technology and what it means for your business, your investment, and you.
Intel this week announced the release of its newest mobile technology, Centrino 2. Centrino 2 features an enhanced CPU utilizing Intel’s 45 nanometer technology, new graphics and chipset, and more powerful wireless connectivity. This latest version of the Centrino platform will lead the way as consumers continue to demand more ...
In this video podcast, we travel to Austin, Texas and the SxSW Interactive festival, to focus on what’s inside people’s computers, and just how much they’re relying on those computers for work, communication and - all-important at the SxSW Festival — creativity.
Intel’s Bryan Rhoads took the opportunity to ...
Intel’s smallest processor to date, built with it’s tiny 45nm transistors for a new wave of small, mobile Internet devices. The chip gets the name Intel Atom. There’s also Intel Centrino Atom, a combination of chip technologies for low cost, low power and high performing devices designed to bring better ...
Explore what’s inside Intel’s first 45nm quad-core and dual-core platform for workstations.
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Gordon Moore’s Law will remain in effect for the foreseeable future. Intel Corporation’s new 45nm Penryn microprocessor relies on a new recipe that combines the element Hafnium and metal gate technology to increase performance and significantly reduce eco-unfriendly, wasteful electricity leaks.
High-performance computing presents unique challenges in performance, energy efficiency and parallel processing, and Intel has just unveiled a unique solution. The Intel Xeon processors and platforms use an entirely new transistor formula based on the second generation of the Intel Core microarchitecture. Intel’s new high-performance computing (HPC) platform ...
Discover what Intel is innovating for your digital life - interoperable devices communicating with a centralized home storage server.
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Listen in as Intel Fellow Knut Grimsrud explores the challenges and opportunities in nonvolatile memory for platforms.
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Intel Mobile Technology Evangelist, Mike Trainor, unveils promising new technological advancements built into Intel’s latest and upcoming mobile processors and platforms.
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Intel Senior Fellow, Kevin Kahn, provides insight into Wi-MAX, Ultra Wide Band technologies and the exciting future of mobile and wireless computing.
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Intel Senior Fellow, Steve Pawlowski, explores the next 10 years of challenges and innovation for Intel architecture.
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“Penryn” is the name for the upcoming family of processors built on new technology that Intel co-Founder Gordon Moore called one of the biggest advances to transistors in 45 years, PodTech’s Jason Lopez talks with Richard Dracott, General Manager of the High Performance Computing Organization in the Digital Enterprise ...
Justin Rattner, Intel’s chief technology officer, explores what 3D Web and the rise of virtual communities means for online communication and the technology industry.
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Explore how Intel is working to enable new freedoms in mobile information, interaction, user-generated content, and social networking with WiMAX broadband wireless technology.
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Day 3 takes technology to exciting new heights with key disclosures on Software and 3D Web. Tune in as Allyson recaps the best, brightest and most promising news from the IDF-SF.
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Get connected with the pulse of Day 2 at the Intel Developer Forum, as Allyson visits the Technology Showcase and recaps key disclosures on Mobility, Penryn and Power Management.
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Tune in to get the latest on exciting new technology disclosures and happenings from the Intel Developer Forum (IDF) including Paul Otellini’s keynote and Gordon Moore’s interview.
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Halogenated materials are an electronics industry norm – hear how Intel is creating a new norm by innovating halogen-free products for a healthy planet.
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In another world’s first, Intel has produced a fully functional 32nm SRAM logic chip packing more than 1.9 billion second generation high-k metal gate transistors.
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Intel’s next-generation 45nm Hi-k microarchitecture (code named “Nehalem”) is a dynamically scalable microarchitecture that delivers breakthrough energy-efficient performance.
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Introducing Intel’s next-gen distributed shared memory architecture featuring high speed interconnects.
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US data centers consumed 61 billion kW hours of electricity in 2006 - learn how Intel and the industry are applying technology and research to mitigate energy consumption.
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How does Intel contend with rapid innovation cadence, long development cycles and mid-stream energy regulations? Tune in to find out!
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Tera-bytes of digital information in your home or office? Learn how Intel is designing solutions for entry level storage.
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